IBM Research Lab, EPFL and ETH Zurich researchers have joined hands to supply future computers with eco-friendly 3D microchips that huddle numerous transistors per cubic centimeter for better performance. Consuming a negligible amount of energy, these powerful chips have vertically stacked cores for easy connection i.e. 100 to 10,000 connections per square millimeter. Therefore, these ensure that the data travels at a relatively higher speed i.e. 10 times than the traditional single-core chips.

Nevertheless, there is lesser heat gain, much lower than the usual 85 degrees Celsius in single core electronic components, the researchers, side-wise, are working on a cooling system to overcome it even. The system has channels inserted between each core layer and filled with a cooling liquid. The liquid exits the circuit as vapor, which is further liquefied by a condenser and finally, pumped back into the processor. We need to wait to see the initial prototypes installed by 2015 and more advanced chips with integrated cooling system by 2020.

Via: Online Latest News500616